Nearly 34 years devoted to exploiting and expanding core business capabilities by managing the research and development of electronic packaging, RF and digital connectors. Hands-on development of glass-to-metal and metal-to-metal bonding techniques and processes to guarantee MIL-STD reliability and longevity. Designer and fabricator of numerous custom automated process and assembly tools. Extensive facility layout and workflow design for factory efficiency and quality improvements. Formerly responsible for maintaining packaging roadmaps and championing a campaign for the adoption of Advanced Packaging technologies across BAE Systems’ Electronic Systems Business Areas. Strong interest in supporting the development of an exquisite high-performance, military-grade, advanced packaging technology for Digital and Mixed Signal ICs (including photonics) using a low latency manufacturing method capable of and suitable for prototype to production quantities which can be leveraged by the commercial industry. Champion for advanced glass-based microsystem packaging for Department of Defense applications.
Jeff Fitzgerald
