In the electronics packaging industry? Join GE Aerospace, IBM Research, ASE Group, and more on September 4-5 at the 35th Annual Electronics Packaging Symposium hosted by Binghamton University’s Integrated Electronics Engineering Center (IEEC) and Center for Microelectronics Manufacturing (CAMM). This symposium brings together leaders in academia, industry and government to network and discuss the latest advances in the field of electronics packaging.
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