AI and 6G systems are pushing the limits of performance, power, and integration, positioning glass substrates as a critical enabler of next-generation advanced packaging. With global semiconductor leaders expanding their U.S.-based manufacturing footprints, the need for coordinated domestic capability in advanced packaging is becoming increasingly urgent. This event convenes leaders across the ecosystem to align technology, validation, and adoption pathways—accelerating the use of glass substrates and strengthening U.S. leadership.
GOALS OF THE CONFERENCE:
- Actively gather real-world perspectives from participants on the challenges, opportunities, and actions needed to drive glass microsystem packaging.
- Discuss practical ideas to mitigate glass adoption barriers and strengthen customer confidence and market readiness.
- Understand where today’s glass supply chain breaks—and how collaboration across materials, equipment, packaging, and validation is required.
- Coordinate industry, government, and research to define clear, actionable next steps.
WHO SHOULD ATTEND:
- Semiconductor Industry Partners: Manufacturers, suppliers, and service providers interested in glass-based packaging solutions for AI, 5G/6G, PNT and quantum applications.
- Startup & Small Design Houses: Innovators needing access to production-quality tools to prototype and validate glass-based designs.
- National Security & Defense Officials: Representatives from U.S. government programs and defense-related organizations focused on domestic supply chain strength.
- Academic & Research Institutions: Researchers and workforce training experts from universities involved in collaborative R&D and glass materials innovation.
- Ecosystem & Strategy Leaders: Policymakers and regional stakeholders shaping the long-term growth and resilience of the microelectronics ecosystem.
May 14-15, 2026
Thursday, May 14 Location:
NY Creates
257 Fuller Rd
Albany, NY 12203
Friday, May 15 Location:
Hilton Albany
40 Lodge Street
Albany, NY 12207
Registration Fees:
Early Bird: $249 – Ends April 10, 2026
Standard: $399 – Starts April 11, 2026
Hosted By:
AGENDA
Thursday, May 14, 2026 - Day One
1:00pm – 1:30pm: Registration
1:30pm – 3:15pm: Welcome & Keynotes
- Paul C. Kelly, Vice President of Strategies, Partnerships, & New Ventures and Chief Operating Officer (COO), NY Creates
- M.Bilal Hachemi, Ph.D., Senior Market and Technology Analyst, Yole Group
3:15pm – 3:30pm: Break
3:30pm – 5:30pm: Panel Sessions
The Business Case for Glass: What Would Make Glass a Buying Decision?
Glass hasn’t been held back by performance—it’s been held back by adoption risk: unclear cost exposure, fragmented standards, nascent supply chain, and the “first customer” problem. This panel focuses on what decision-makers actually need to justify adoption, including where system-level economics (power, bandwidth per watt, reliability, integration, redesign cycles) change the ROI. The goal is to identify what evidence and conditions move glass from pilot interest to purchase orders.
Foundations for a U.S. Glass Substrate Collaboration: What Industry Needs from a Complementary Domestic De-Risking Service
Accelerating U.S. adoption of glass substrates will require more than isolated investments — it demands complementary regional hubs that reduce risk, strengthen supply resilience, and shorten time to deployment. New York State and the broader Northeast region, offers a unique convergence of assets critical to scaling glass-based substrate manufacturing and advanced packaging. This session highlights the region’s strengths, positioning it as a natural hub for glass substrate manufacturing, assembly, and test at national scale.
5:30pm – 7:30pm: Opening Reception
Friday, May 15, 2026 - Day Two
7:00am – 8:00am: Registration
8:00am – 9:30am: Breakfast & Keynote
Madhavan Swaminathan, Department Head, Electrical Engineering and Director, CHIMES at Penn State University
09:30am – 10:30am: Panel Session
What It Takes to Validate Glass for Real Products (and the Role of AI)
Larger, more complex glass-based semiconductor packages are complicating product qualification and reliability testing. This panel focuses on manufacturing-grade validation requirements from the customer and integrator perspective: real world performance data, qualification discipline, yield confidence, integration readiness, and shared test standards that remove uncertainty. We will also examine how AI-driven methods can accelerate reliability analysis, defect detection, and process optimization.
10:30am – 10:45am: Break
10:45am – 11:45am: Industry Spotlight
Today’s Capabilities, Tomorrow’s Scale
A series of brief talks from industry leaders providing a practical snapshot of what exists today across glass substrates, packaging, assembly, test, and integration. Speakers will focus on what they can deliver now, what customers are asking for next, and the gaps that must close for glass to become a standard option in real product roadmaps.
11:45am – 1:00pm: Lunch
1:00pm – 2:30pm: Audience Workshop: Fostering Coordination and Collaboration
Interactive workshop using live polling to explore the need for a glass consortium, shape its structure and identify key issues the consortium would solve.
2:30pm – 3:00pm: Summarize & Conference Close
KEYNOTE SPEAKERS
SPEAKERS & PANELISTS
SPONSORS
PARTNERS
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