Manufacturing Round Up for the Week of 07/03/17

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Growth in SiC Power Modules a Boon to Upstate New York

“Danfoss Silicon Power will establish packaging operations in Utica’s Computer Chip Commercialization Center (Quad-C), generating more high-skill jobs in that area while advancing SiC technology.”
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SUNY Poly-led AIM Photonics and NY-Power Electronics Manufacturing Consortium highlighting research, collaboration at SEMICON West

“SUNY Polytechnic Institute – in partnership with Empire State Development (ESD), the American Institute for Manufacturing Integrated Photonics (AIM Photonics) and the New York Power Electronics Manufacturing Consortium (NY-PEMC) – says some of its leading researchers, scientists from a number of its corporate partners, and New York State economic development experts will share R&D updates at the SEMICON West 2017 conference in San Francisco (11-13 July).”
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Additive manufacturing added to defense bill

“In the upcoming U.S. Department of Defense Authorization bill, Congresswoman Elise Stefanik included language to promote additive manufacturing.”
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CEDA: Aurelius business expands with help from state funding

“As mentioned in my last column in March, the New York state budget has produced another round of funding of the Consolidated Funding Applications to incentivize private investment through the Regional Economic Development Councils.”
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Legislature to vote on former Beech-Nut site

“The Montgomery County Legislature is poised to vote on a resolution to foreclose on the former Beech-Nut baby food manufacturing plant.”
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Diamond Packaging Wins Three Awards in 24th Annual FSEA Gold Leaf Awards Competition

“Diamond Packaging won three awards in the 24th Annual FSEA Gold Leaf Awards Competition, the industry’s premier showcase for foil stamping, embossing, and other specialty effects.”
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Laser-marking and new colors fill RTP line-up

“Materials maker RTP Co. is finding success with laser-markable compounds and has unveiled a new color lineup as well.”
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